The PCI-Express standards-setting organization is creating a thin interconnect that would link mobile devices such as smartphones and tablets to external peripherals, the organization’s chief said on ...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has extended its ...

Allowed claims support HoverCam’s plug-and-play wireless architecture for driverless, network-independent multimedia ...

Backed with competitive intelligence and benchmarking, our research reports on the molded interconnect device (MID) market are designed to provide entry support, customer profile and M&As as well as ...

On Thursday, several major tech companies, including Google, Intel, Microsoft, Meta, AMD, Hewlett-Packard Enterprise, Cisco, and Broadcom, announced the formation of the Ultra Accelerator Link (UALink ...

Kopin Corporation (NASDAQ: KOPN), a leading provider of application-specific optical systems and high-performance microdisplays, including MicroLED displays, today announced a strategic collaboration ...

The scaling of system-on-chip (SoC) architectures is hitting the wall, paving the way for die-to-die interconnect in heterogenous single-package systems commonly known as chiplets. But while these ...

Introducing a new suite of fabless semiconductor technologies designed to power AI factories—smart data centers optimized for producing intelligence at scale; Initial focus on MicroLED optical ...

Introducing a new suite of fabless semiconductor technologies designed to power AI factories—smart data centers optimized for producing intelligence at scale; Initial focus on MicroLED optical interco ...

Fabric.AI (Nasdaq: FABC) (“Fabric.AI” or “the Company”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation "AI factories," today announced the ...

Chipmakers’ focus on new interconnect technology is ramping up as copper’s effectiveness continues to diminish, setting the stage for a significant shift that could improve performance and reduce heat ...

“The main motivation of this review is to study the evolution of first and second level of interconnect materials used in memory device semiconductor packaging. Evolutions of bonding wires from gold ...