Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just announced its new AuraStack AI Super Agent.
The AuraStack AI super agent coordinates advanced PCB and package design with simulation and sign-off but leaves application-specific tradeoffs to engineers. By Abhishek Jadhav, embedded.com ...
The AI-native environment is designed to streamline PCB and advanced packaging design from start to finish.
Cadence says its AuraStack AI Super Agent is the industry's first agentic AI platform for PCB and advanced packaging design.
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Cadence Allegro X AI automates PCB placement and routing for small to medium size designs, reducing physical layout and analysis from days to minutes. Accessed through the Allegro X Design Platform, ...
This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. Cadence has launched AuraStack, its latest "Super Agent" AI platform, designed to halve the ...
Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents across planning, implementation, etc.
This is where Cadence’s AuraStack AI Super Agent (Fig. 2) comes into play. You can watch a short demo in the video above.
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