Stress concentration analysis in composite and orthotropic plates is a critical area of research that addresses the localisation of stress in regions of geometric discontinuity, such as holes or ...

The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

The cause of failure in engineering structures is routinely investigated via the detailed study of material fracture surfaces. This remains a key research area in material sciences, with researchers ...

The last few years have shown progress in finite-element analysis intended for use by design engineers. Many programs that work with CAD provide several different types of analysis, and the range of ...